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The FR4 Copper Clad Laminate Sheet is a flame-retardant composite board consisting of an FR4 epoxy glass-fabric base material bonded with a high-purity copper foil on one or both sides. It combines the excellent electrical insulation, mechanical strength, and dimensional stability of FR4 with the conductivity of copper, making it the standard substrate for printed circuit boards (PCBs). This sheet features strong peel strength, low moisture absorption (≤0.10%), high flexural strength (≥400 MPa), and a UL94 V-0 flammability rating. It withstands continuous operation up to 130–140°C and offers outstanding dielectric properties (up to 20 kV/mm for the base laminate). Available in various thicknesses (0.2 mm to 3.2 mm, or custom) and copper weights (½ oz to 10 oz per ft²), with standard panel sizes such as 1040×1240 mm, and 18″×24″. The copper surface can be further treated with anti-tarnish, OSP, or other finishes. Widely used in double-sided and multilayer PCBs, RF circuits, power electronics, automotive controls, and consumer electronics.
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