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This is copper clad laminate (CCL), a foundational core material widely used in the printed circuit board (PCB) manufacturing industry. It is fabricated by bonding one or both sides of a substrate — typically made from epoxy resin, phenolic resin, or other reinforced composite materials like fiberglass cloth — with high-purity, high-conductivity copper foil under strict high-temperature and high-pressure conditions.
Boasting excellent electrical insulation performance, strong thermal stability, outstanding chemical corrosion resistance, and high mechanical structural strength, this product provides reliable support and a conductive circuit carrier for electronic components. It serves as the essential base material that enables PCBs to achieve stable signal transmission, efficient heat dissipation, and long-term operational reliability, and is extensively applied across consumer electronics, communication equipment, automotive electronics, industrial control systems, and new energy fields.
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